· Mainly used in large base stations and other high-power and high-energy electronic components, such as circuit board and soft connection for large base stations
· Low powder loss, high resistance to high-temperature oxidation and high flexibility
· Widely used in automotive electronics, medical instruments and other fields, such as: FPC, high-end electromagnetic shielding
· Low powder loss, high resistance to high-temperature oxidation, high folding resistance and high flexibility
· Widely used in automotive electronics, medical devices, wearable electronics and other fields, such as: fine FPC, soft connection, RF module, etc
· Low powder loss, excellent etching, low roughness, high resistance to high-temperature oxidation, and high flexibility
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